Our Products in Charging Pile Thermal Management – Overview

Liquid-Cooled Charging Pile – Thermal Path Analysis

Diamond-based cold plates are the next-generation thermal solution for 800V/1000V high-voltage platforms, 500A–1000A high-current, and megawatt-level ultra-fast charging. With ultra-high thermal conductivity + micro-channels + CTE matching, they break through the high-flux cooling bottlenecks of power modules, charging cables, and connectors — delivering half the temperature rise, double the power capacity, extended service life, and simplified maintenance.

Thermal Dissipation Path

Device Heat Generation → Diamond High‑k Substrate Rapid Spreading → Micro‑Channel Wall Heat Exchange → Coolant Heat Removal → External Heat Exchanger Dissipation

Application Scenarios

1. Power Module Cooling (Core Inside the Pile)

Location: AC/DC rectifiers, DC/DC converters, SiC power modules.

Solution: Diamond micro-channel liquid cold plates attached to power devices, with forced convection cooling via coolant circulation.

2. Liquid-Cooled Charging Gun & Cable (Interface Core)

Solution: Charging gun head with diamond-coated electrodes + integrated micro-liquid cooling cavity and built-in coolant channels.

Core Advantages: Ultra-high thermal conductivity, low thermal resistance, CTE matching, and light weight — solving traditional cooling limitations. Short-term adoption in premium ultra-fast charging; long-term, as costs decline, becoming mainstream standard — driving charging technology toward higher power, higher efficiency, and greater reliability.