Panoramic View of Our Products' Heat Dissipation Applications at the Chip Level

Deep-Dive Analysis of Chip Liquid Cooling Thermal Path

Today’s high-end AI chips employ a mainstream five-tier vertical liquid cooling architecture. The diagram below illustrates the complete heat flow path — from the chip core to the final removal by coolant.

Heat Flow Path

Chip → High-Thermal-Conductivity CCL → Diamond Heat Spreader → Thermal Interface Material (TIM) → Micro-Channel Liquid Cold Plate

Key Functions of Each Tier

GPU/CPU: Heat source core

High-Thermal-Conductivity CCL: Thermal diffusion bridge for packaging

Diamond Heat Spreader: Rapidly spreads point-source hotspots into planar heat flow

Thermal Interface Material (TIM): Diamond-based high-thermal-conductivity TIM fills microscopic gaps

Micro-Channel Liquid Cold Plate: Final heat exchange interface