Panoramic View of Our Products' Heat Dissipation Applications in Optical Modules

Deep-Dive Analysis of Optical Module Thermal Path

This diagram illustrates the thermal management path from core to enclosure in high-speed optical modules, leveraging diamond-based heat dissipation technology.

Heat Flow Path

DSP/Chip Heat → PCB → TIM Interface Layer → Diamond–Cu Heat Spreader → Diamond–Al Finned Housing → External Dissipation

Key Functions of Each Tier

CCL (PCB): Carries high-speed optical chips/circuits, ensures low-loss high-frequency signal transmission, and serves as the starting point for heat conduction.

Thermal Interface Material (TIM): Eliminates air gaps between PCB and heat spreader, drastically reduces interfacial thermal resistance, enabling efficient heat transfer.

Diamond–Cu Heat Spreader: Leverages diamond's ultra-high thermal conductivity to rapidly spread heat laterally and conduct it upward, preventing localized hot spots.

Diamond–Al Finned Housing: Acts as the final heat dissipation unit — fins increase surface area for forced-air cooling while providing mechanical protection.