The mainstream five-tier vertical liquid cooling architecture currently adopted by high-end AI chips fully illustrates the complete heat flow path — from the chip core to the final removal by coolant.
Diamond-based thermal technology builds an efficient thermal management path for high-speed optical modules: chip heat travels through the PCB and TIM interface, then is conducted by the diamond–copper heat spreader to the diamond–aluminum finned housing for rapid heat dissipation.
The core logic of AI server thermal management is to build a low-resistance, high-efficiency, controllable "full-link thermal channel" for high-power GPUs/CPUs — enabling rapid extraction, transfer, and rejection of chip heat, preventing localized overheating, and ensuring stable computational performance.
The complete liquid cooling system, through multi-tier low-resistance thermal channels, solves the high-power and high-heat-flux cooling challenges of AI servers, achieving efficient temperature control across the entire data center facility.
This solution breaks through the cooling bottlenecks of IGBT modules under high switching frequencies and high power densities, significantly reducing junction temperature fluctuations while enhancing module reliability and service life. It serves as a premium thermal management solution for new-energy vehicles, industrial drives, energy storage converters, and more.
Diamond-based materials address the thermal bottlenecks of conventional solutions with four core advantages: ultra-high thermal conductivity, low thermal resistance, CTE matching, and light weight. In the short term, they will first be deployed in premium ultra-fast charging scenarios; in the long term, as costs decline, they will become mainstream standard, driving charging technology toward higher power, higher efficiency, and greater reliability.
The power density of robots' "brains" (AI chips) and "muscles" (servo drives) continues to rise, pushing traditional copper/aluminum cooling solutions to their physical limits. Diamond-based materials, with their ultra‑high thermal conductivity, emerge as the "ultimate solution" for extreme heat‑flux densities.
Diamond bonding technology empowers satellites and radar: GaN-on-diamond solutions enhance RF performance and heat dissipation, while SiC-on-diamond solutions strengthen voltage tolerance and cost-effectiveness. Together, they address the core pain point of high-power thermal management and serve as the essential cooling technology for phased-array systems.
1. Loading and sealing: The powder is loaded into a flexible mold and vacuum sealed to prevent infiltration and contamination.
2、Pressurization and pressure maintaining: Place the sealed mold into a pressure vessel, fill it with pressure, and maintain the pressure to fully densify the powder.
3、Pressure relief and demolding: Slowly release the pressure, remove the mold, and peel off to obtain the greenware.
1 Extremely high and uniform density: The density variation can be controlled to be ≤1.5%, which is significantly better than that of unidirectional pressing (5%–10%), greatly reducing the risk of sintering cracking.
2 High green strength: easy to handle, store, and machine (turn, grind, drill).
3 No mold wall friction: no lubricant required, high purity, stable performance.
4 Wide range of applications: Capable of molding large-sized and complex-structured components.
1、Green compact preparation: Obtain fully densified green compacts through cold isostatic pressing.
2、Infiltration: Place the green compact in a vacuum chamber, with metal powder placed above it. Heat it to a temperature above the melting point of the metal under vacuum or a protective atmosphere, and apply a certain pressure (atmospheric pressure or mechanical pressure) to force the molten metal to infiltrate the green compact.
3、Cooling process: After cooling, remove the mold and proceed with subsequent finishing processes.
Ø High density (>98%), high thermal conductivity (up to 550–900 W/(m·K))
Ø The diamond has a high volume fraction, uniform distribution, and a low thermal expansion coefficient (6–8ppm K⁻¹)
Ø It can achieve rapid and high-quality molding, making it suitable for large-sized and complex structural components.
1、Place the green body into the vacuum hot pressing equipment;
2、Vacuumize or introduce protective gas;
3、pressurize;
4、Heating, heat preservation, cooling and demolding.
1、The sintering speed is extremely fast, with a temperature rise rate of up to several hundred degrees Celsius per minute, which can greatly inhibit grain growth and harmful interfacial reactions.
2、 It has extremely high density and can maintain a fine microstructure.
3、Suitable for the preparation of high-performance diamond composite materials.
Henan Shuhui New Material Co., Ltd. specializes in the full industrial chain layout of diamond materials and is a high-tech enterprise integrating product design, research and development, production, sales, and technical services. The company positions itself as a "provider of integrated diamond material solutions in the fields of high-end thermal management and semiconductor packaging". It covers six major product categories, specifically including: diamond monocrystalline/polycrystalline substrates, heat sinks; diamond-copper/aluminum/molybdenum/silicon carbide composite thermal conductors and heat sinks, and casings; high-frequency, high-speed, high-thermal conductivity, low-dielectric M9/M10 copper-clad laminates, and TVG glass substrates; customized diamond composite heat dissipation modules; aluminum-based silicon carbide; and quantum diamonds. It has established a complete industrial ecosystem from CVD diamond monocrystalline/polycrystalline substrates, diamond composites, high-end packaging/thermal management devices, to quantum diamonds. It adheres to technological innovation and quality standards, aiming to empower high-end manufacturing with autonomy and controllability.
100+
Team personnel
10year
Industry experience
100+
Partner
By the end of 2025, Beijing Lunling Energy Construction Technology Co., Ltd. and Jingjia Micro will jointly develop diamond copper tube shells for thermal conductivity in AI chip casings, utilizing a full range of diamond products. By deeply exploring the diamond application field, they aim to become the "ultimate answer" in the global diamond thermal conductivity material sector, allowing all high-end electronic devices and semiconductor components to unleash their ultimate performance in a cool environment. With the power of Aurora, they will innovate cooling solutions for the world, empowering high-end manufacturing fields such as copper clad laminates and semiconductors with precise product layout and ultimate product quality, and forging the "Shuhui brand" in diamond material applications
"Material upholds the aurora, crystal builds the core path; heat dissipation reveals its nature, cold environment is reborn"
Empowering high-end manufacturing with superhard material technology, adhering to the bottom line of precision manufacturing, and laying a solid foundation for product quality; only under extreme heat can the stability and efficiency of diamond thermal conductive materials be seen.
Using technological innovation as an engine, we expand the application boundaries of diamond materials, supporting the upgrading of high-end manufacturing industries with high-quality materials, and empowering the electronic equipment and semiconductor industries to rejuvenate
Material genome breakthrough:Focusing on CVD polycrystalline/monocrystalline and diamond composite thermal conductive materials, we aim to achieve the optimal balance of "high-efficiency heat dissipation + cost controllability" for thermal conductive materials and "high performance + process adaptability" for semiconductor packaging materials through material formulation and interface structure design, breaking through the core technological bottlenecks in the industry.
Scenario-based thermal control and semiconductor adaptation architecture:We provide an integrated solution from substrate, copper clad laminate to heat sink, housing, and carrier board, addressing the full-scale needs from nanoscale hotspots in thermal management chips to macroscopic thermal fields in energy storage/computing systems, as well as the demands of high-power, high-frequency, and high-temperature extreme scenarios in the semiconductor industry.
Thermal simulation pre-processing + semiconductor collaborative R&D:Deeply integrate AI thermal simulation with experimental data, intervene in optimization during the customer's product design phase. Collaborate with semiconductor manufacturers in R&D, adapt to the packaging needs of fourth-generation semiconductor devices, and become a collaborative R&D design partner in the thermal management materials sector.
Reborn Ecology:The founder's experience of "living towards death" has condensed into a unique corporate culture, attracting those who break through adversity and long-term thinkers, and forming a highly resilient R&D and production team to support continuous technological breakthroughs and product launches in new fields.