Panoramic View of Our Products' Heat Dissipation Applications in Liquid-Cooled Data Centers

Liquid-Cooled Data Center – Full-Scope Thermal Management Analysis

The complete liquid cooling system addresses the high-power, high-heat-flux cooling challenges of AI servers through a multi-tier, low-resistance thermal channel, achieving efficient temperature control across the entire facility.

Heat Flow Path

GPU/CPU Core → TIM → Diamond–Cu Liquid Cold Plate → Rack Liquid Cooling Loop → CDU → Facility Cooling System (Cooling Tower/Chiller) → Ambient Environment

The full thermal management chain of a liquid-cooled data center ultimately forms a closed loop — from chip to outdoor environment.

Functions of Each Tier

GPU/CPU Core: Computing heat source, high-flux concentrated heat, prone to overheating and throttling.

TIM: Fills microscopic gaps, eliminates air insulation layers, reduces interfacial thermal resistance — opens the first thermal gate.

Diamond–Cu Liquid Cold Plate: Leverages ultra-high thermal conductivity to rapidly spread chip hotspots; internal flow channels enable solid–liquid heat exchange, pushing cooling limits.

Liquid Cooling Loop: Coolant carries heat away from cold plates, circulated and exchanged via CDU — forming a complete rack-to-facility closed-loop thermal solution.

Core Advantages

Interface resistance reduction

Material-level heat spreading

Liquid cooling as primary

Full-facility closed-loop integration

Ideal for ultra-high-power racks, lowering PUE, and boosting compute density and operational stability.